Introduction:Even though FLASH memory is a well-established memory technology, continuous advances, such as multi-level cell (MLC), are aimed at achieving increased density. New measurement techniques and capabilities are also becoming available, from characterizing a single transistor for development purposes to integrated and automated solutions for FLASH production.
During this webinar, fundamentals of FLASH technology testing will be reviewed, incorporating a discussion of FN (Fowler-Nordheim) and (HEI) (Hot Electron Injection) programming and erasing. Different aspects of testing applicable to single FLASH transistors and FLASH array testing will be considered, including standard transistor characterization, endurance, and disturb testing. The pulse fidelity requirement for MLC testing will also be discussed. These applications will be demonstrated via Keithley's new Ultra Fast I-V test solution, which offers better control of the pulse shape and amplitude, and, as a result, is well-suited for MLC FLASH testing, and also Keithley's ACS software, which manages a range of testing scenarios.
Target Audience
This webinar will be beneficial for people with established FLASH test setups, as well as those looking for a test solution.

Introduction:Phase Change Memory, a type of non-volatile computer memory also known as PRAM, PCM, and PCRAM, is a new and promising technology. PRAM uses the unique behavior of chalcogenide glass, which can be switched between two states, crystalline and amorphous, with the application of heat. Recent versions can achieve two additional distinct states, effectively doubling its storage capacity.
This webinar will provide basic information on the physics and operation of PRAM memory elements. Common characterization and measurement techniques will be described and compared, including the R-Load method and a technique using Keithley抯 ultra-fast IV unit.
Target Audience:
This seminar is recommended primarily for test engineers and test engineering managers who are new to making PRAM measurements, but it will be useful for the experienced user, as well.

Introduction:NXP is an active member of the HDMI Consortium, and was one of the first to invent HDMI connectors. NXP's offering extend to a complete system solution, used today by several of the world's key SoC manufacturers. We operate our own HDMI compliance test facility in Caen, France, where we carry out the strictest of ESD testing and product requirements.
During this webinar, I will provide an overview of the HDMI switches available from NXP today, and describe the special features which help to differentiate our products. I will also give you a glimpse of NXP's implementation of the latest HDMI 1.4 specifications. I look forward to your participation in this webinar.

Introduction:TCA and uTCA are getting popular in today's infrastructure systems. We see an increasing number of designs with bus supporting multiple daughter cards. The first Hot-swap control chip was introduced to reduce the inrush current when plugging a card into the backplane. Now, the hot-swap technology is far more mature.
In this seminar, learn how to control hot-swap reliability, stability and overall cost with your backplane control scheme in this seminar. Also, find sample waveforms that demonstrate how intelligent current-power limit combined technology helps with hot-swap interface design.

Introduction:With LabVIEW, engineers and scientists can acquire and output real-world signals, analyze data for meaningful information, develop embedded or autonomous systems, and share results with displays, reports, and the Web. Watch this webcast to learn the fundamentals of graphical programming and discover how LabVIEW can benefit your applications by providing data acquisition and signal generation, signal processing and analysis, connectivity with third-party hardware and software, and desktop, embedded and industrial deployment.

Introduction:Have you ever had trouble designing a new sensor? If so, don't miss the chance to learn how to easily compare hundreds of sensors and complete your sensor path design with National's new online tool. In this webinar, we will go through a new tool with three simple steps: learn about and explore sensors, compare and select the best sensor for your application, and then design and build your solution. We will also share with you design tips and considerations that will support your time-to-market plans.

Introduction:In the past, FPGAs were typically low density and low performance梪sed primarily as "glue" logic to piece together a system. Today, FPGAs are high density, high performance components梪sed to implement major system functionality. Since the current trend is to use multiple FPGAs on a PCB, how do you effectively and efficiently integrate the two? New FPGA/PCB concurrent design processes and tools significantly improve system performance, product costs, and designer productivity. This session will discuss these new design approaches.