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Ken Yeap - Field Application Engineer, National Semiconductor
Ken Yeap is responsible for design applications and customer technical enquiries in Malaysia and the Philippines.Mr. Yeap has 4 years working experience in electronics industry, in which 3 years was responsible for design and trouble-shooting of consumer electronic products in Sony. Prior to joining National, he worked for LTC's distributor as FAE.Mr. Yeap holds a Bachelor degree in Electrical Engineering, with major in Telecommunications Engineering, from University of Technology Malaysia.

Experts:
Steven Teo - Field Application Engineer
Srinivas Menon - Field Application Engineer
Dragon Li - Product Application Engineer
Tony Lai - Product Application Engineer
Janet Wu - Product Application Engineer
Honsun Tan - Product Application Engineer
MH Lau - Product Application Engineer
Winter Cheng - Product Application Engineer


 
 
Overview

TCA and uTCA are getting popular in today's infrastructure systems. We see an increasing number of designs with bus supporting multiple daughter cards. The first Hot-swap control chip was introduced to reduce the inrush current when plugging a card into the backplane. Now, the hot-swap technology is far more mature.

In this seminar, learn how to control hot-swap reliability, stability and overall cost with your backplane control scheme in this seminar. Also, find sample waveforms that demonstrate how intelligent current-power limit combined technology helps with hot-swap interface design.

Company Introduction

National Semiconductor creates energy-efficient analog and mixed-signal semiconductors. Its PowerWise® products enable systems that consume less power, extend battery life, and generate less heat. Headquartered in Santa Clara, Calif., National reported sales of $1.89 billion for fiscal 2008 which ended May 25, 2008. Additional company and product information is available atwww.national.com