High temperature accounts for 55% of electronic product failures. In general, a 1℃ increase above the maximum limit can lead to 5% reduction in the product's reliability.
The second part in a series on thermography, this webinar teaches you how to: 1. Use a thermal imager to supplement routine tests by tools like oscilloscopes and multimeters. 2. Gain a better understanding of the load profile of components using a color-coded thermal profile. 3. Use a thermal imager to locate problems like short circuits or components in the absence of in-circuit or functional testing.
Engineers attending the webinar take away the knowledge and tools that aid better circuit design, lower power consumption and higher conversion efficiency.

This seminar will introduce the topic of Hall Effect measurements as they relate to semiconductor materials and device characterization. Hall Effect measurement systems are commonly used to determine semiconductor parameters, such as carrier mobility and carrier concentration, Hall coefficient, and conductivity and conductivity type. Participants in this seminar will learn:  • What are Hall Effect measurements?  • Who can use Hall Effect measurements?  • What industry trends are driving the need for Hall Effect measurements?  • What are the key considerations when selecting equipment for Hall Effect measurements?  • What techniques will help ensure quality measurements?
Target Audience: This seminar is recommended for materials scientists and physicists studying the electrical properties of new materials such as new nanomaterials, and engineers, materials scientists, and physicists developing thin films for solar/photovoltaic applications, working with compound semiconductor materials, or studying the properties of carbon-based devices as well as for all characterization lab managers and anyone new to semiconductor materials and testing.

Temperature profiling during actual loading is an important measurement parameter for any engineer. When designing computing, consumer, communications or other systems, high power and high temperature go hand-in-hand. You must ensure your design will not fail because of excessive heat from components like power amplifiers and MMICs.
This webinar aims to take the pain out of temperature profiling for thermal analysis. You will learn:
1. How you can do away with the complexity of setting up calibrated data acquisition systems with thermocouples.
2. How you can significantly speed up the profiling process.
3. How you can use infrared thermography to achieve direct, reliable measurements from within an enclosed casing.
Two experts from Fluke present the process and standby to assist you with specific concerns.

This seminar is designed to help reliability engineers understand and implement state-of-the-art Bias Temperature Instability (BTI) measurements using Ultra-Fast I-V methods. The first segment of the seminar examines the current theory of positive and negative BTI (PBTI and NBTI) mechanisms in ultra thin film transistors. The second segment addresses the measurement challenges and defines the best methods for Ultra-Fast I-V measurements for capturing both degradation and recovery characteristics. Those participating in this seminar will learn:  • The current theories behind modeling NBTI and PBTI  • Challenges associated with characterizing BTI degradation and recovery  • State-of-the-art measurement techniques for modeling and process control  • Limitations in Ultra-Fast I-V including Johnson Noise and others  • Tips on characterizing measurement system performance
Target Audience: This seminar is intended for those whose job requires performing semiconductor reliability characterization measurements. The material is particularly beneficial for students, technicians, engineers, and lab managers who are responsible for developing test systems and methodologies to address the need of ultra thin film transistor reliability.

Electrical resistivity is a basic material property and is a very common electrical measurement. Specific resistivity measurement methods are used depending upon the type of material, whether conductor, insulator, or semiconductor. This webinar provides details on the various resistivity methods and techniques used to achieve optimal results. Participants will learn the fundamentals of making resistivity measurements on bulk materials. The methods vary depending on if the material is a conductor, an insulator, or a semiconductor. Some of the specific methods include making four-wire resistance measurements of metals, volume and surface resistivity measurements of insulators, and four-point collinear probe and van der Pauw measurement methods of semiconductor materials. In addition to discussing these methods, measurements techniques that pertain to the method are also detailed. Some of the many techniques and sources of error discussed include electrostatic interference and shielding, leakage current and guarding, thermoelectric EMFs and offset compensation, and others. Along with using the proper method and techniques, the appropriate instrumentation must also be used to make the desired measurements. Target Audience This webinar is recommended for materials researchers, research labs, physicists, universities, and companies who need to test resistivity of their products (solar cell, plastics, paper, tires, semiconductor, etc.)